Solder Embrittlement

Gold Embrittlement of Solder Joints

Gold embrittlement of solder joints has been written about for at least four decades [1 – 3]. Nevertheless, gold embrittlement related solder joint failures have been analyzed in this laboratory as recently as July 2009. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. The purpose of this paper is to provide a detailed account of ma...

Microwave embrittlement

Mikrovlnné žiarenie frekvencie 2,45 GHz bolo použité na vzorkách uhlia z rôznych anglických lokalit, na ich tepelnú predúpravu pred rozpojovaním. Získané údaje poukazujú na vplyv mikrovlnnej tepelnej úpravy na relatívnu meliteľnosť uhlia. Výrazná redukcia ( 20 –40 % ) relatívnej energie mletia bola zaznamenaná už po pomerne krátkom čase pôsobenia mikrovlnného žiarenia (3 –8 min). Vplyv mikrovln...

Reactor Pressure Vessel Embrittlement—i

Electromigration in Solder Joints and Solder Lines

Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...

Characteristics of Hydrogen Embrittlement, Stress Corrosion Cracking and Tempered Martensite Embrittlement in High-strength Steels

Characteristics of tempered martensite embrittlement (TME), hydrogen embrittlement (HE), and stress corrosion cracking (SCC) in high-strength steels are reviewed. Often, it is important to determine unambiguously by which of these mechanisms failure occurred, in order to suggest the right actions to prevent failure recurrence. To this aim, samples made of high-strength AISI 4340 alloy steel wer...